16th International Conference on
Plasma Surface Engineering
September 17 - 21, 2018
Congress Center. Garmisch-Partenkirchen. Germany
Fundamentals and applications of plasma and ion beam techniques in surface engineering
The 16th International Conference on Plasma Surface Engineering will be held, as usually, in Garmisch-Partenkirchen, Germany, from Monday, September 17 to Friday, September 21, 2018. The biennial PSE conference series is organized by the European Joint Committee on Plasma and Ion Surface Engineering.
With a continuously growing interest in the preceding PSE events, with more than 700 participants from all over the world in 2016, PSE is a well-established and leading forum in the field of plasma as well as ion- and particle-beam assisted surface modification and thin film technologies.
PSE provides an opportunity to present recent progress in research and development and industrial applications. Its topics span a wide range from fundamentals such as e.g. process modelling and simulation of plasmas or thin film physics, through experimental studies which establish the relationships between process parameters and the structural and functional properties of modified surfaces and/or thin films, towards the application in industrial production.
With numerous industrial exhibitors and a large fraction of participants from industry (36% in 2016), a special feature of PSE is the intimate and vivid interaction between those being involved in basic research and those who have to meet the rapidly increasing demands in industrial production.
PSE 2018 will be dedicated to “MEMS in our everyday life”. Microelectromechanical systems (MEMS) have infiltrated our daily lives, having found their way into a broadening variety of applications from smartphones to cars, with millions more uses in between. Applications are becoming increasingly diverse in nature, and each has its own unique specifications. The role of plasma processes for the elaboration of MEMS will be stressed out to fulfill the “magic” triptych: smaller footprint,